The International Conference on Vibration Engineering (ICVE) serves as a vital platform that brings together scholars and engineers with a shared interest in vibration theory and its engineering applications. It stands as a significant venue for interdisciplinary dialogue and collaboration, attracting a diverse audience from academia, research institutions, and industry. Since its inception, the ICVE has been held in various cities, including Wuhan Chongqing (1990), Beijing (1994), Hong Kong (1995), Dalian (1998), Nanjing (2002), Dalian (2008), Shanghai (2015), and Shanghai (2021). The 9th International Conference on Vibration Engineering (ICVE2025) is scheduled to take place from October 24-26, 2025, at the Nanjing International Conference Hotel, Nanjing, China.

This conference offers a rigorous and innovative forum, offering emerging researchers the opportunity to gain valuable insights, enabling seasoned professionals to stay at the cutting edge of the latest advancements, and fostering meaningful networking opportunities for all participants. A symposium for young elite scientists will be scheduled during the conference. Submissions are invited for research papers, innovative studies, and works in progress that investigate various aspects of vibration in engineering contexts.

The extended abstract and full paper should comprehensively define the research objectives, current status, methodology and results of the study. All submissions will be evaluated by the International Technical Committee (ITC) and excellent full papers will be recognized and recommended for publication in top journals. 

To submit an abstract, extended abstract, full paper or poster, please utilize the online submission system

https://icve2025.scimeeting.cn

and follow the corresponding templates. Authors can submit the abstract firstly before June 01, 2025 and the extended abstract or full paper (optional) before July 30, 2025. Please ensure that all submission steps are completed accurately and that the correct session ID is selected.